Author Archives: Gene

About Gene

Gene Weiner has spent his entire career -- spanning more than 50 years -- in the printed circuit and semiconductor industries. He spent the early part of his career in R&D as a student technician at MIT Lincoln Laboratories, then became employee no. 4 at Shipley, and later vice president of sales and marketing at Dynachem and president of New England Laminates. He has been a consultant to leading materials, circuit board and semiconductor companies for several years, and sits on the board of Wong’s Kong King International and the MBA advisory board of the Malcolm Baldridge School of Business at Post University. He was inducted to the IPC Hall of Fame in 2006.

New Motivation?

On the eve of the industry’s largest PWB show, I have begun to reflect on what the American expats whom I will meet here are doing for their Greater China employers. I wonder what they could not have done in the United … Continue reading

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Comings and Goings

Big news: IBM will “sell” its chip operations to GlobalFoundries according to a joint statement by the companies. IBM will pay “the buyer,” owned by the government of Abu Dhabi, a reported $1.5 billion over the next three years to … Continue reading

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End of Summer — End of an Era?

Which is the way forward? New or renew? Nepcon in Shenzhen Aug. 26-28 was “OK” in terms of attendance. Lots of prospects/”tire kickers” but very few buyers. Japan’s high-tech PWB volume in June increased  8.6% over that of June 2013, but revenue … Continue reading

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Looking Forward

The Taiwan Printed Circuit Association (TPCA) announced at a press conference attended by nearly 100 members of the government, industry, research institutes, academia and the media that it will publish a white paper in September to address the future Taiwan … Continue reading

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The Post-Silicon Era

Masamitsu “Matt” Aoki has updated his detailed charts of “Build-Up Types of Printed Wiring Boards and Their Applications in Japan” (Version 14.1) and “Thin Types of Printed Wiring Boards and Their Applications in Japan” (Version 24.1). They are both now … Continue reading

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Bypassing 2.5D

Did Nvidia’s announcement that it would use 3D packaging with silicon-through-vias on some forthcoming Pascal graphics processors to make more memory available with minimal delays signal the start of a general acceptance of stacked memory chips? IPC Apex Expo was … Continue reading

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Defining the New World

Where are 2 1/2D and 3D going? How will “active” interposers be defined — and where will they be used? What’s the real scoop for TSVs (through-silicon vias)? The Pan Pacific Microelectronics Symposium held this month seemed to confuse some … Continue reading

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No New Lessons for 2014

Here we go again! It is 2014 and I have read the obligatory half dozen or so 2013 reviews about our industry. I searched for something unique, something significant, and something that would provide me with lessons learned that would … Continue reading

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Changing Times

Many name brands are now gone, never to return.* Others have been sold off (merged into others) and will be bled for opportunistic sales. Their product ranges included dry film photo resist, drilling machines (laser and mechanical), phototool generators, test … Continue reading

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New Technologies at the TPCA Show

The mood at the TPCA Show in Taipei last week was relatively somber with light activity on the show floor even as the technical conference had a strong showing. It was a bit of a shock (but not totally unexpected due … Continue reading

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