Author Archives: Mike

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow

Actual and Potential Use of Drones in Precision Agriculture

Ed.: This is a guest blog by Alex Danovich of San Francisco Circuits. Unmanned Aerial Vehicles (UAV), Unmanned Aerial Systems (UAS), Remotely Piloted Aircraft (RPA) or more commonly referred by mass media as drones are gaining popularity and often discussed for … Continue reading

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Peter Biocca, RIP

Peter Biocca, the longtime face of Kester Solder in the southern US and Mexico, passed away Monday from cancer. I knew Peter for more than 15 years, dating back to his time with Multicore, when he was one of the regulars … Continue reading

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Wilk the Winner

Congratulations to Edward Wilk of Facts Engineering, who won the incentive prize for filling out a recent survey of PCB West 2014 technical conference attendees. Edward, a $50 AMEX gift card is headed your way. Thanks for your support, and thanks … Continue reading

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Optimal at Optimum

As corporate models go, Optimum Design Associates isn’t unique. Several firms have launched as design shops only to add EMS capability as they matured. But one thing ODA does that I really like is provide a much greater level of detail about … Continue reading

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The HP Split

Those wondering how the HP split might shake out should read this piece in Bloomberg today. In summary, HP’s PC group just lost some of its pricing advantage, as the servers and other business-oriented gear are going with the new Hewlett-Packard Enterprise company. HP … Continue reading

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Red Makes Green

The arrival of India’s Mars Orbiter is an achievement on many levels. Much will be made of the fact that it is the first Asian satellite to reach the red planet’s orbit. That they accomplished it on their first try … Continue reading

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The End of the Viasystems Era

At long last, the hunter became the hunted. TTM Technologies today announced its pending acquisition of Viasystems. The deal, expected to close in early 2015, will vault TTM to second place among the world’s largest PCB fabricators. No matter how … Continue reading

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Who Needs 2 Newspapers?

Juxtapositions can funny, even when the subject is serious. From DigiTimes today: Foxconn considering lawsuit over leukemia report “Foxconn Electronics (Hon Hai Precision Industry) is considering taking legal action against UK-based Daily Mail for its recent report claiming Foxconn employees working … Continue reading

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Wave of Innovation

Old friend Jeff Miller (some readers may remember him from his ACT and Wise days) took this photo of a 3D printed car this week while at IMTS in Chicago. Meanwhile, while at PCB West earlier this week, we saw the … Continue reading

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Hitachi’s SMT Exit

And then there were … 27? Hitachi’s board today announced plans to exit the SMT component placement business, selling off certain parts of the division and closing the rest. In a press release, the firm said it would transfer the … Continue reading

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