Author Archives: Mike

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow

Time to Go?

I spoke today with a longtime friend in the PCB industry who shared that multiple times in the past year his company had made inquiries to various suppliers about various lines of equipment. They specifically asked for quotes on certain … Continue reading

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In Trade War of Words, Huawei Goes on Offensive

“Huawei won’t move manufacturing to America.” The headline sounds, well, weird, almost like “Tiffany’s not robbed.” But the crux of it is a tale of global politics and business tactics growing ever-more-fascinating by the day. In short, at the Consumer … Continue reading

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The Top 10 of 2016 — Circuits Assembly

Each year we review the 10 most-viewed features of PCD&F and CIRCUITS ASSEMBLY. This year, we’ll start with CA. Keep in mind that the counts are not adjusted by the date of publication. Therefore, an article published in January has an … Continue reading

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Don’t Expect Apple to Fall for US Again

Analysis of the impact of Apple moving its production — or at least some of it — to the US will continue over the next several months but with the imminent change in US administration it could be peaking now. … Continue reading

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Alloy Metal Weight Fraction Calculation

Iasad writes, “Dear Dr. Ron, I see that you have developed software to calculate the density of an alloy if given the weight fractions of the constituent metals. Is it possible to find the weight fractions of the metals in … Continue reading

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Car Talk

The US Department of Transportation is recommending mandatory vehicle-to-vehicle communication for all new cars and trucks through a short-range wireless technology, as part of a plan to reduce the number of road accidents. The agency’s recommendations come after a pilot … Continue reading

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Self-Driving Car Laws Take the Road

Michigan on Friday became the first state in the US to pass extensive statewide regulations related to self-driving vehicles, and one of only eight in total to ratify any laws governing the technology. The laws are significant in that for … Continue reading

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Foxconn in the Hen House?

At the risk of beating the drum once too often, I again call your attention to the ever-more-grandiose “plans” bandied about regarding Foxconn. The latest: A $7 billion investment into US electronics manufacturing that would lead to thousands of new jobs. … Continue reading

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RoHS: 10 Years After

Every so often, I get to work on a project that I find utterly rewarding. The RoHS article in this month’s issue of PCD&F/Circuits Assembly was one such project. Titled “Was RoHS Worth It?“, it attempts to recap the chaos and … Continue reading

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Patents, Home and Abroad

The annual review of the world’s patent filings always tells an interesting story. Some 2.9 million applications were filed in 2015, up 7.8% year-over-year. China led with 1.01 million filings, followed by the US (526,000) and Japan (454,000), reports the … Continue reading

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