Author Archives: Mike

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow

Slowdown at Foxconn

Posted on April 11, 2013 by Mike

Could PCs do what the rest of the EMS industry could not — derail the Foxconn train? Over the past decade, Foxconn has been practically unstoppable. Not a backlash against China, outrage over dozens of worker suicides, at least two … Continue reading →

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H-1B Free?

Posted on April 6, 2013 by Mike

Those in favor of lifting limits on the US government H-1B visas, which allow workers from other countries to take jobs in the US, might want to read this alternate view. Tech companies in particular say the program is essential to … Continue reading →

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The Top 50 EMS Companies Chat

Posted on April 3, 2013 by Mike

The electronics manufacturing services industry in 2012 saw something of a changing of the guard as major European players like Elcoteq, ElectronicNetwork and SRI Radio Systems dropped off the map, and dependable stalwart industries like military and PCs experienced slow … Continue reading →

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EU to Feel Conflict Crunch?

Posted on March 28, 2013 by Mike

Is Europe about to get its environmental comeuppance? After perhaps billions of dollars were spent transforming the electronics supply chain to reflect the European Commission’s RoHS and WEEE directives, the EC is now considering adopting a version of the US … Continue reading →

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The Biggest of the Big

Posted on March 28, 2013 by Mike

Coming next week, the annual CIRCUITS ASSEMBLY Top 50 EMS providers. Who were the biggest gainers and fallers? We will have the full story for you on April 1.    

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Robotics Competition an Eye-Opening Experience

Posted on March 20, 2013 by Mike

Ever wondered, as you survey the ever-greying and balding crowd at a trade show, where our next crop of engineers, technicians and scientists will come from? Gary Ferrari and I* had just this conversation at a recent Designers Council event … Continue reading →

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China v Japan

Posted on March 7, 2013 by Mike

I’m not sure what to make of this video describing the economic impact of a war between China and Japan. Now, please understand that I think the odds of this happening are almost impossibly remote under the current administrations. When … Continue reading →

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The March Issue of PCD&F/CA

Posted on March 6, 2013 by Mike

… is now out. The cover story, “Bridging Technology between Conventional 3D and TSV 3D Stacking,” looks at two new multi-die DRAM packages with thin profiles that minimize wirebond length. Among the other features: My recap of the Apex Expo … Continue reading →

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Robots on Trial

Posted on March 6, 2013 by Mike

This Boston Globe article poses interesting questions about the legal and moral responsibilities of robots (yes, robots). In summary, does the legal system need to adapt to adjudicating cases where artificial intelligence-run machines make decisions based on their own reasoning, … Continue reading →

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Will Juki-Sony Talks Get Others Going?

Posted on February 6, 2013 by Mike

Industry chatter has long said M&A activity among the major placement companies is inevitable. Yet throughout the gut-wrenching downturn of 2001-02, the widespread pause in 2008-09, and the subsequent fallout starting last spring, nothing concrete took place. Sure, a few … Continue reading →

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