Author Archives: Mike

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow

The Best-Read PCD&F Articles in 2014

As we did with CIRCUITS ASSEMBLY on Monday, here’s the list of the best-read new articles at PCDandF.com this year. Leading the pack was IMI president Peter Bigelow, whose piece “When ‘Scaling Up’ Leads to ‘Belly Up’ ” received the most hits of … Continue reading

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Is Sharing for Suckers?

In my January editorial I asked, “Absent a government-industry technical agency, is the US shooting itself in the foot?” My comments were made in response to a former Bell Labs researcher who wrote that the US should consider reestablishing a government-supported technology … Continue reading

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The Most-Read CIRCUITS ASSEMBLY Articles of 2014

People often ask what our most popular topics are. There are many ways to slice and dice that, but what we’ve done the past few years is announced the Top 10 most-read articles of each year. Number one in 2014 … Continue reading

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2014: The Year of the Deal

Today brings to an end one of the most fascinating years of acquisitions since the crazy Internet era of late 1990s and 2000. Unlike that episode, however, 2014 was a much more orderly state of affairs, and while some of … Continue reading

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Higher (Cost) Education

Rensselaer Polytechnic is an outstanding academic institution, one that has minted more than a few of the stellar engineers working in the electronics industry today. And you can count me among those who believe that if we want to ensure that top minds … Continue reading

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IPC Apex Expo Programs Highlight Technology and Innovation

Ed.: This is a guest blog from IPC. No matter where you are in the global electronics supply chain, you’ve probably heard the phrase, “I need it now.” In this fast-moving, ever-evolving industry, we hear that a lot. What drives … Continue reading

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The December Issue of PCD&F/CA

Our December issue hits the digital streets today and features a cover story from Terry Munson at Foresite, who performed a comparison of analytical techniques using 25 conformal-coated no-clean assemblies after environmental testing for 40°C/90%RH for 168 hr. Terry found FTIR, … Continue reading

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Actual and Potential Use of Drones in Precision Agriculture

Ed.: This is a guest blog by Alex Danovich of San Francisco Circuits. Unmanned Aerial Vehicles (UAV), Unmanned Aerial Systems (UAS), Remotely Piloted Aircraft (RPA) or more commonly referred by mass media as drones are gaining popularity and often discussed for … Continue reading

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Peter Biocca, RIP

Peter Biocca, the longtime face of Kester Solder in the southern US and Mexico, passed away Monday from cancer. I knew Peter for more than 15 years, dating back to his time with Multicore, when he was one of the regulars … Continue reading

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Wilk the Winner

Congratulations to Edward Wilk of Facts Engineering, who won the incentive prize for filling out a recent survey of PCB West 2014 technical conference attendees. Edward, a $50 AMEX gift card is headed your way. Thanks for your support, and thanks … Continue reading

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