Author Archives: Dr. Ron

About Dr. Ron

Materials expert Dr. Ron Lasky is a professor of engineering and senior lecturer at Dartmouth, and senior technologist at Indium Corp. He has a Ph.D. in materials science from Cornell University, and is a prolific author and lecturer, having published more than 40 papers. He received the SMTA Founders Award in 2003.

Lead Free 2015

It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently asked to speak at the Boston SMTA Chapter on The Status of … Continue reading

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Alloy Melting

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste.  One of our engineers claimed that the problem was that the tin finish melts at too high a temperature (Tm= … Continue reading

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Wave Soldering is Here to Stay

Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It was Patty’s turn to take … Continue reading

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Electronics Assembly Process Optimization

Mike Madigan was not used to feeling intimidated.  After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating.  However, he had just finished a meeting with the CEOs of his … Continue reading

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What is Cicret and Why is It Important?

Folks, Let’s check in on Patty … Patty had to admit that she was getting annoyed. Two of the female engineering students were always going to her husband Rob’s office for help with their homework. At first glance this would … Continue reading

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Pin-in-Paste Aperture Calculations Using Solder Preforms

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, ensuring that the correct volume of solder paste is printed to ensure … Continue reading

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Calculating Optimal Solder Paste Printing Aperture Parameters

Folks, A while ago, I developed an Excel-based spreadsheet, StencilCoach, that calculates optimal stencil aperture parameters for several common SMT solder paste printing applications. These applications include standard apertures, passive apertures, pin-in-paste (PiP) apertures, and preforms with pin-in-paste (PiP+) apertures. … Continue reading

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Low-Temperature Solders: Niche No More?

Folks, It surprises many people that the foundation metal of almost all solder alloys is tin. Alloy elements such as lead, silver, copper, indium, etc., are extremely important, as they lower the solder melting temperature below tin’s relatively high 232°C … Continue reading

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Is the PC (or Tablet or Smartphone) Dead or Dying?

Folks, We hear, on a regular basis, that the PC is dead or dying and will be replaced by the tablet. More recently, there is news that the tablet is starting to fade and even, most recently, that the smartphone … Continue reading

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The False Positive Paradox

Folks, Let’s check in on Patty… Patty was intensely preparing a lecture on Bayes’ Theorem. She always felt that this theorem was the most profound in probability and statistics. She remembered a real application, when her best friend took the … Continue reading

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