Author Archives: Dr. Ron

About Dr. Ron

Materials expert Dr. Ron Lasky is a professor of engineering and senior lecturer at Dartmouth, and senior technologist at Indium Corp. He has a Ph.D. in materials science from Cornell University, and is a prolific author and lecturer, having published more than 40 papers. He received the SMTA Founders Award in 2003.

Sample Size is Important in Weibull Analysis Too

Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering decisions. Recently, a reader asked if sample size is important … Continue reading

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An Example of Cpk and Non Normal Data In Electronics Assembly Soldering

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her excitement. For the next couple of hours her … Continue reading

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Cpk Can Only be Calculated from Data that are Normally Distributed

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a series of classes at Ivy … Continue reading

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My BBC Interview on Tin Pest

Imagine my excitement when Laurence Knight of the BBC contacted me to see if I was interested in being interviewed on the topic of tin pest, with a secondary discussion on tin whiskers. After a 30-minute phone call, it appeared … Continue reading

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The Importance of Oxygen Barrier in Solder Pastes

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had was wave soldering. In wave soldering, the … Continue reading

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Lack of Concern for Tin Pest as a Reliability Issue in Mission Critical Products Still Hard to Understand

Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability concerns related to tin whiskers, I am surprised that there has been essentially … Continue reading

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Density Calculation Still Raises Questions

Folks, It is hard to believe, but I have been blogging now for over 8 years. In all of that time, the most popular topic by far has been the calculation of alloy densities. Many people are troubled by the … Continue reading

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IPC Tin Whisker Conference Sheds New Light

Folks, I just returned from SMTA/INEMI’s Medical Conference in Milpitas (near San Jose/San Fransisco), where I spoke on tin whiskers. I then quickly traveled to Costa Mesa (400 miles south, near Los Angeles), to IPC’s Tin Whiskers/Reliability Conference, where I … Continue reading

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Is the PC Dead?

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay. Patty saw a link on one of the daily industry newsletters that piqued her interest. It was titled, “A New Alloy for Medical Electronics Applications.” The paper … Continue reading

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Patty and the Professor: What Homogeneous Means

Folks, Let’s see how Patty and Pete are doing with their Medical Device RoHS Crisis …. Patty and Pete sat in a plane on the runway of the Manchester, NH, airport. Patty was just calming down after Jeff Sparkel  told … Continue reading

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