Category Archives: Weiner’s World

Industry veteran Gene Weiner gives his perspective on the happenings and history of the electronics and printed circuit board industries.

Reshoring

I am often asked by those in the printed circuit and electronic packaging industries about reshoring. My response generally is that reshoring is a myth. It seems that whenever I try to contact someone by email I get an automated response … Continue reading

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Industry 4.0: The Great Equalizer?

Gen Consutling Co. (GCC) has issued the Radiant Insights report “Global HDI Printed Circuit Board Market Forecast and Analysis 2016-2021.” The report provides a detailed analysis of worldwide markets for HDI Printed Circuit Board from 2011-2016, and provides market forecasts … Continue reading

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New Motivation?

On the eve of the industry’s largest PWB show, I have begun to reflect on what the American expats whom I will meet here are doing for their Greater China employers. I wonder what they could not have done in the United … Continue reading

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Comings and Goings

Big news: IBM will “sell” its chip operations to GlobalFoundries according to a joint statement by the companies. IBM will pay “the buyer,” owned by the government of Abu Dhabi, a reported $1.5 billion over the next three years to … Continue reading

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End of Summer — End of an Era?

Which is the way forward? New or renew? Nepcon in Shenzhen Aug. 26-28 was “OK” in terms of attendance. Lots of prospects/”tire kickers” but very few buyers. Japan’s high-tech PWB volume in June increased  8.6% over that of June 2013, but revenue … Continue reading

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Looking Forward

The Taiwan Printed Circuit Association (TPCA) announced at a press conference attended by nearly 100 members of the government, industry, research institutes, academia and the media that it will publish a white paper in September to address the future Taiwan … Continue reading

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The Post-Silicon Era

Masamitsu “Matt” Aoki has updated his detailed charts of “Build-Up Types of Printed Wiring Boards and Their Applications in Japan” (Version 14.1) and “Thin Types of Printed Wiring Boards and Their Applications in Japan” (Version 24.1). They are both now … Continue reading

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Bypassing 2.5D

Did Nvidia’s announcement that it would use 3D packaging with silicon-through-vias on some forthcoming Pascal graphics processors to make more memory available with minimal delays signal the start of a general acceptance of stacked memory chips? IPC Apex Expo was … Continue reading

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Defining the New World

Where are 2 1/2D and 3D going? How will “active” interposers be defined — and where will they be used? What’s the real scoop for TSVs (through-silicon vias)? The Pan Pacific Microelectronics Symposium held this month seemed to confuse some … Continue reading

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No New Lessons for 2014

Here we go again! It is 2014 and I have read the obligatory half dozen or so 2013 reviews about our industry. I searched for something unique, something significant, and something that would provide me with lessons learned that would … Continue reading

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