The March Issue of PCD&F/CA

… is now out.

The cover story, “Bridging Technology between Conventional 3D and TSV 3D Stacking,” looks at two new multi-die DRAM packages with thin profiles that minimize wirebond length.

Among the other features:

  • My recap of the Apex Expo trade show in February.
  • Some key areas of the Benchmark Electronics’ Robotics manufacturing process, from a prototype or new-build stage to steady-state production.
  • The new IPC-2221B design standard.
  • Designing high-speed, small area boards.
  • Determining whether a process generate an electrostatic charge, and if so, how much.
  • We answer the question, Can a flex circuit be made with platinum or gold conductors rather than copper?
  • Selective soldering dwell times.
  • And the latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.

Check it out.

 

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow
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