Defining the New World

Where are 2 1/2D and 3D going? How will “active” interposers be defined — and where will they be used? What’s the real scoop for TSVs (through-silicon vias)? The Pan Pacific Microelectronics Symposium held this month seemed to confuse some attendees and point out the apparent need to sort out the terminology used in various packaging schemes. One must wonder how the discovery of “artificial graphene” reported by a European university will affect the development of applications for the real thing?

Value and change — topics for consideration and discussion. How do you determine value? How much is a semiautomatic printer for LPISMs worth if it can produce better than 2.0 mil (50um) dams in 1.0 mil (25um) thick solder mask? How much is a system that exposes a “standard” mask in less than 7 sec. worth? At what point does one replace a fully depreciated piece of equipment or a line with a more advanced capable system? What is the ideal or minimum practical “payback” time in your facility? How much does it truly cost you to evaluate a “free” sample of a material or specialty chemical? Can you determine the value of a new system/product simply by yield improvement? Or by throughput? Or reduction in energy usage? Or waste disposal costs? What would it take for you to install a new “not-in-kind system” replace an old “standard”? How do you respond to an offer of a “new” technology? What claims or benefits would motivate you to take action to evaluate it? Let us know!

About Gene

Gene Weiner has spent his entire career -- spanning more than 50 years -- in the printed circuit and semiconductor industries. He spent the early part of his career in R&D as a student technician at MIT Lincoln Laboratories, then became employee no. 4 at Shipley, and later vice president of sales and marketing at Dynachem and president of New England Laminates. He has been a consultant to leading materials, circuit board and semiconductor companies for several years, and sits on the board of Wong’s Kong King International and the MBA advisory board of the Malcolm Baldridge School of Business at Post University. He was inducted to the IPC Hall of Fame in 2006.
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