I posed a question about using copper pours (AKA flood) a not long ago. The premise was a simple microcontroller board with a 20MHz clock and no special requirements.
I had a couple of different comments on the post with some very good insight. Myself, I generally don’t use copper pours. My only reason is that I think it usually looks better without (although I do like the look of the cross-hatch pour on the Arduino). A well done flood can be pretty cool, but still my inclination is to only use it if it’s needed. If it’s a shop doing the PCB, the metal will be recovered and recycled, so the conservationist in me is pleased.
If it’s a home-etched deal, then a pour is probably a better idea because it will reduce the amount of etchant needed. Although you do need to be careful to keep plenty of space between things to prevent solder bridges. Solder bridging isn’t such a big deal on a PCB with a good solder mask, but it certainly is on a board with no mask or thin mask.
If there is a good reason, I will. Like a high-current motor driver — I use the pour to keep the current capacity up and the kelvons mellow. Heat-sinking is a good reason for a pour. High-speed stuff usually benefits from a flooded plane of some sort too and in four-layer boards, using the innerplanes for power and or ground is nice and convenient. But you all know that. I’m just rambling now.
Does high speed stuff on a flooded plane require a speed boat?
Will too much heat sink it?