Tag Archives: 0.3mm BGA
Let’s Get Small, as in 0.3mm
Not long ago, I wrote about a 0.3mm pitch wafer-scale BGA we received and were asked to place. The gist of that article was that those parts are very small and we d0n’t yet have a process that we feel … Continue reading
Posted in Screaming Circuits Blog
Tagged 0.3mm BGA, Components, wafer-scale packages
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It (0.3mm) Finally Happened
Back in January of 2012, I wrote about the possibility of 0.3mm pitch BGAs being used here and there. I predicted that in a year, we’d see some 0.3mm pitch BGAs showing up. I was about three months off. Almost … Continue reading
Posted in Screaming Circuits Blog
Tagged 0.3mm BGA, component placement, Land pattern, packaging
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