Tag Archives: BGA

Lead Free 2015

It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently asked to speak at the Boston SMTA Chapter on The Status of … Continue reading

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Using the Newest Gen Arm Microcontrollers

I’ve written a few times about the new Freescale KL03 ARM Cortex M0+ microcontroller. This particular part comes only in very small packages, with the smallest being a 1.6 x 2mm WLCSP (wafer level, chip scale package) 0.4mm pitch, 20 bump … Continue reading

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Component Packages — Let’s Get Small

I’ve been on a bit of a package binge lately. First talking about metric vs. US passive sizes, and then a very tiny ARM Cortex M0 from Freescale. The Freescale BGA part checks in at 1.6 x 2mm. That’s cool and I’m almost always … Continue reading

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0.4mm Pitch BGA is Awesome

I recently had a conversation with a friend about 0.4mm pitch BGAs. The specific part is the FreescaleKL03 ARM Coretex-M0+ microcontroller in a 1.6mm x 2mm, 04.mm pitch package. That’s a 20-ball wafer scale BGA form factor. I don’t have an … Continue reading

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More Beagle CAD Paws

Continuing on from my last post … As I said, I do everything I can to avoid reusing the package footprint when adding the the parts library in Eagle CAD. The schematic symbol can be a different story though. It … Continue reading

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How Not to Trick Your BGA Friends

Continuing with yesterday’s theme, I have a couple examples that should have been fine, but due to issues at the board house, improper storage or contamination, ended up very much not fine. Behind door number one, we have an OSP … Continue reading

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Let’s Get Small – 0.3mm Pitch BGA

I recently got an email from Practical Components about its new 0.3mm pitch evaluation board and dummy 0.3mm pitch BGA. Now, we’ve been assembling 0.5mm and 0.4mm pitch BGAs for years. Those sizes are kind of not really anything special … Continue reading

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Reducing Conversion Costs

Let’s look in on Patty … Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues  on reducing the head-in-pillow (HIP) defect at a plant in Minnesota. HIP can be … Continue reading

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BGA Pads with Vias

No. This isn’t a closeup of an owl face. There is still some debate on how best to create a land pattern for a 0.4mm pitch BGA. We recommend solder mask defined pads at that pitch. But that’s not really … Continue reading

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Favorites

What’s your favorite MCU package and why? The DIP is big and easy to use. You can stick it in a breadboard (wireless or soldered), a socket or easily hand solder it. But, it tends to be more expensive and … Continue reading

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