Tag Archives: BGA

More Beagle CAD Paws

Posted on December 10, 2012 by Duane

Continuing on from my last post … As I said, I do everything I can to avoid reusing the package footprint when adding the the parts library in Eagle CAD. The schematic symbol can be a different story though. It … Continue reading →

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How Not to Trick Your BGA Friends

Posted on June 13, 2012 by Duane

Continuing with yesterday’s theme, I have a couple examples that should have been fine, but due to issues at the board house, improper storage or contamination, ended up very much not fine. Behind door number one, we have an OSP … Continue reading →

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Let’s Get Small – 0.3mm Pitch BGA

Posted on January 9, 2012 by Duane

I recently got an email from Practical Components about its new 0.3mm pitch evaluation board and dummy 0.3mm pitch BGA. Now, we’ve been assembling 0.5mm and 0.4mm pitch BGAs for years. Those sizes are kind of not really anything special … Continue reading →

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Reducing Conversion Costs

Posted on November 30, 2011 by Dr. Ron

Let’s look in on Patty … Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues  on reducing the head-in-pillow (HIP) defect at a plant in Minnesota. HIP can be … Continue reading →

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BGA Pads with Vias

Posted on October 25, 2011 by Duane

No. This isn’t a closeup of an owl face. There is still some debate on how best to create a land pattern for a 0.4mm pitch BGA. We recommend solder mask defined pads at that pitch. But that’s not really … Continue reading →

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Favorites

Posted on June 24, 2011 by Duane

What’s your favorite MCU package and why? The DIP is big and easy to use. You can stick it in a breadboard (wireless or soldered), a socket or easily hand solder it. But, it tends to be more expensive and … Continue reading →

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Picking Packages

Posted on April 8, 2011 by Duane

A long, long time ago, in a place pretty close to here, picking a form factor was easy. Your CPU came in a 40 pin DIP. Your logic came in 14 or 16 bit dips. You picked resistor sizes based … Continue reading →

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Bouncing BGAs

Posted on March 21, 2011 by Duane

I dropped my cellphone on the pavement the other day. That’s bad enough, but in my instinctive attempt to catch it, I actually hit it and increased its downward velocity. Luckily, everything still works. The odd thing is that I … Continue reading →

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Nightmare on BGA Street

Posted on February 9, 2011 by Duane

I seem to be in a bit of a BGA mood lately. I do that sometimes – pick a subject and talk it to death before moving on. Well, maybe not quite talk it to death, but at least talk … Continue reading →

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BGA Woes

Posted on February 4, 2011 by Duane

Quite a few of the new chips I see coming out stick to the BGA or QFN form-factor. Sometimes they’ll be referred to as WSP (wafer scale package) or CSP (chip scale package), but those are still just little BGAs. … Continue reading →

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