Tag Archives: Circuits Assembly

The March Issue of PCD&F/CA

… is now out. The cover story, “Bridging Technology between Conventional 3D and TSV 3D Stacking,” looks at two new multi-die DRAM packages with thin profiles that minimize wirebond length. Among the other features: My recap of the Apex Expo … Continue reading

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On Jerry Murray’s Passing

We at UP Media are, of course, very sad and distressed to hear the news of of our former colleague Jerry Murray’s passing. Jerry worked for UPMG and its predecessors for more than 20 years. I came late to that … Continue reading

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If there was a lot of tweeting going on, I think I’d call it “flutter.” I could call it “a bunch of Twitter tweets,” but that’s too long and awkward, so I’m good with flutter. Probably because it’s short and … Continue reading

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Fire Away

We at long last have added a comments section to the Circuits Assembly website. Specifically, readers may now add their two cents to all articles, op-ed pieces and news items. We are using the Disqus platform for comments, a popular … Continue reading

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