Tag Archives: electronics assembly

Pin-in-Paste Aperture Calculations Using Solder Preforms

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, ensuring that the correct volume of solder paste is printed to ensure … Continue reading

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Dover’s Big Exit

Is it the water? Just days after Cookson announced it would split in two and spin out its Alpha Metals solder unit, Dover says it too will divest its electronics assembly and test businesses. Just like that, we are primed … Continue reading

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Can Your Mortality be Modeled with Weibull Distribution?

Folks, In the last posting we saw how Weibull analysis helped us to determine that SACM lead-free solder (SAC 105 with about 0.1% manganese) has comparable (actually better) thermal cycle performance versus SAC 305 solder.  Software like Minitab will give … Continue reading

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Electronics Assembly in Action

Folks, Struggling to find a good, royalty-free, video of electronics assembly, my Dartmouth ENGM 185 class on manufacturing processes decided to make our own. I think it is pretty good considering our limited ($0) budget. http://www.youtube.com/watch?v=afmz9-D4IPg It was filmed at … Continue reading

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A New Assembly Metric

Patty arrived at work an hour early to prepare for her meeting with ACME CEO Mike Madigan. Nineteen days ago he had asked her to develop an electronics assembly metric that would correlate with profitability. This metric would, in turn, be … Continue reading

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GKG: Westward Ho?

Southeast Asian assembly process equipment companies have approached Western markets in fits and starts. A few have made inroads: From time to time, we have seen JT and Fulongwin soldering equipment at US plants, usually smaller ones (Flextronics is an … Continue reading

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The Media (Us) Gets Social

Besides this blog, we at CIRCUITS ASSEMBLY are active in a number of other social media related forums. You can follow Editor-in-Chief Mike Buetow’s steady stream of late-breaking news on Twitter (@mikebuetow). Or join our LinkedIn groups: CIRCUITS ASSEMBLY, SMT … Continue reading

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Is Flat the Next Big Thing?

The Human Media Lab at Queen’s University, Canada and Arizona State University’s Motivational Environments Research group have teamed up to create what’s been dubbed the “PaperPhone.”  The phone was created with the same e-ink technology found in the Kindle e-book … Continue reading

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The Free Flow of Fakes

While it’s true that counterfeit parts are pervading all aspects of the electronics supply chain (not to mention consuming all amounts of oxygen from industry pundits such as yours truly), is it possible our sense of fear is overblown? By … Continue reading

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CyberOptics’ Coup

It’s always a good deal when you can simultaneously supply an end-product to end-customers and critical components from said end-product to competitors. And that’s the situation CyberOptics now finds itself in after inking a deal last quarter to put its … Continue reading

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