Tag Archives: package-on-package

Beagle-Not-Board

I wandered over to the TI booth at the Embedded Systems Conference to check out the Beaglebone and the MSP430 Launchpad. We haven’t built any Beaglebones yet, but a few years back we took the Open source Beagleboard files and … Continue reading

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Let’s Get Small – 0.3mm Pitch BGA

I recently got an email from Practical Components about its new 0.3mm pitch evaluation board and dummy 0.3mm pitch BGA. Now, we’ve been assembling 0.5mm and 0.4mm pitch BGAs for years. Those sizes are kind of not really anything special … Continue reading

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Underness as a Common Theme Again

I didn’t mean to, but here I seem to be with a common theme again. Like yesterday, and again not too long before that — parts under parts seems to be the thing of the hour. Maybe the caps are … Continue reading

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Pitch Switching

I’ve been reading of 0.3 mm pitch BGAs, but those aren’t totally new. I’m not sure if we’ve done any 0.3 mm pitch before, but we’ve been doing 0.5 mm for years and have done plenty of 0.4 mm pitch … Continue reading

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