Tag Archives: PCB

Comings and Goings

Big news: IBM will “sell” its chip operations to GlobalFoundries according to a joint statement by the companies. IBM will pay “the buyer,” owned by the government of Abu Dhabi, a reported $1.5 billion over the next three years to … Continue reading

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The End of the Viasystems Era

At long last, the hunter became the hunted. TTM Technologies today announced its pending acquisition of Viasystems. The deal, expected to close in early 2015, will vault TTM to second place among the world’s largest PCB fabricators. No matter how … Continue reading

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Hitachi’s SMT Exit

And then there were … 27? Hitachi’s board today announced plans to exit the SMT component placement business, selling off certain parts of the division and closing the rest. In a press release, the firm said it would transfer the … Continue reading

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End of Summer — End of an Era?

Which is the way forward? New or renew? Nepcon in Shenzhen Aug. 26-28 was “OK” in terms of attendance. Lots of prospects/”tire kickers” but very few buyers. Japan’s high-tech PWB volume in June increased  8.6% over that of June 2013, but revenue … Continue reading

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Looking Forward

The Taiwan Printed Circuit Association (TPCA) announced at a press conference attended by nearly 100 members of the government, industry, research institutes, academia and the media that it will publish a white paper in September to address the future Taiwan … Continue reading

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Does Rising Nationalism Pose Threat to Electronics Supply Chain?

The amount of geopolitical discord around the world at present is stunning: Thailand, Vietnam, Korea and other major electronics manufacturing hubs are seeing a rise in nationalism and severe internal tension over how to address foreign pressure. Thailand in May endured … Continue reading

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PCB Panel Routing Technique

Most PCBs we receive are individually routed; i.e., not panelized. That doesn’t mean that, sometimes, sending them in a panel isn’t a good idea, or required. Generally, we don’t require panels (sometimes called a pallet), but there are some cases … Continue reading

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Component Packages — Let’s Get Small

I’ve been on a bit of a package binge lately. First talking about metric vs. US passive sizes, and then a very tiny ARM Cortex M0 from Freescale. The Freescale BGA part checks in at 1.6 x 2mm. That’s cool and I’m almost always … Continue reading

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Open The Pod Bay Doors, HASL

Does anyone use HASL (hot air surface leveling) anymore? It’s also known as HAL. Prior to the RoHS days, HASL was probably the most common surface finish. You can get it lead-free, but most boards seem to use immersion silver … Continue reading

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Changing Times

Many name brands are now gone, never to return.* Others have been sold off (merged into others) and will be bled for opportunistic sales. Their product ranges included dry film photo resist, drilling machines (laser and mechanical), phototool generators, test … Continue reading

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