Tag Archives: pin-in-paste

Pin-in-Paste Aperture Calculations Using Solder Preforms

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, ensuring that the correct volume of solder paste is printed to ensure … Continue reading

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Weibull Part III

Folks, Our discussion of Weibull Analysis continues…. Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste and some lead-free solder preforms as you assembled several through-hole … Continue reading

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Solder/Flux Density

Folks, It is hard to believe that I have been blogging for over 7 years now. In all this time it has surprised me how much interest there has been in the solder density calculator that I developed. At the suggestion of Tim … Continue reading

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