Tag Archives: QFP

More Beagle CAD Paws

Continuing on from my last post … As I said, I do everything I can to avoid reusing the package footprint when adding the the parts library in Eagle CAD. The schematic symbol can be a different story though. It … Continue reading

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Tented QFN/QFP Via-in-Pad

Below is a pretty decent example of mask-tented vias in the thermal pad of a QFP. Most manufacturers recommend no more then 100 – 125 microns wider than the via to minimize voiding and thermal insulation in cases like this. … Continue reading

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