Tag Archives: Reliability
RoHS, Six Years After
Folks, I was at IPC Apex Expo the other week. San Diego is a great venue for the show, but I always forget how cold it can be (55°-65°F) this time of year. While at the show, I was interviewed … Continue reading
Posted in Dr. Ron
Tagged Apex, cost, Dartmouth, Expo, IPC, lead-free soldering, Reliability, Rockwell Collins, RoHS
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Weibull Analysis of Solder Joint Failure Data II
Folks, Last time we introduced Weibull analysis. Let’s derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the cumulative fraction of fails, from 0 to 1. By choosing Ln(t) as x and LnLn … Continue reading
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. It is the first thought of someone trying to model thermal cycle, drop shock, or other failure modes associated with through-hole … Continue reading
Revelations at ACI
Folks, I’m taking a few moments from Wassail Weekend, held annually in my village, Woodstock, VT (“The prettiest small town in America”), to write a post about the recent workshops at ACI. Indium colleague Ed Briggs and I gave a … Continue reading
Posted in Dr. Ron
Tagged ACI, Ed Briggs, ENIG, Graping, immersion silver, lead-free, OSP, reflow, reflow profiling, Reliability, soldering, surface finishe, tin pest, tombstoning
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Thanks, Hitachi!
This week I made it official. I retired my Hitachi VT 2000A VCR. It’s been a long time coming. I bought it in 1988, while in college. Since then, I’ve watched approximately 4 million* movies on it. And even after … Continue reading