Tag Archives: RIM

Predictions for 2013

It’s been awhile since I used this space to make any predictions about the coming months, but the end of the year is always the logical (if cliched) time to do so. So here goes: The migration of manufacturing to … Continue reading

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Talking Data Transfer at ZDAC

I had the great pleasure of attending Zuken’s ZDAC users group meeting earlier this month in San Antonio at the invitation of Steve Chidester, head of product marketing, and Amy Clements, marketing/sales manager. Steve and Amy had asked me to … Continue reading

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Summer Doldrums

Is it cyclicality, or … ? Many reports, anecdotal and evidentiary, point to a general slowing in PCB production and sales over the past quarter. The July PMI, a broad-based manufacturing index, remains positive but is at its lowest mark … Continue reading

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No More A-‘void’-ance

Did avoiding the voids just get less important? A new study by Rockwell Collins, RIM, Indium and Dage shows voids are not a “primary” issue to BGA solder joint integrity. New BGA voiding requirements to be proposed to J-STD-001 task … Continue reading

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