Tag Archives: SAC 305
Can Your Mortality be Modeled with Weibull Distribution?
Folks, In the last posting we saw how Weibull analysis helped us to determine that SACM lead-free solder (SAC 105 with about 0.1% manganese) has comparable (actually better) thermal cycle performance versus SAC 305 solder. Software like Minitab will give … Continue reading
Posted in Dr. Ron
Tagged electronics assembly, SAC 105, SAC 305, solder joint reliabilty, solder paste, Weibull distribution
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Some Consensus on SAC
Back in November, I posted comments on lead-free availability. In this post, I mentioned that I chaired a session at SMTAI on Alternate Alloys. At this session, Greg Henshall presented a paper on the Low Silver BGA Sphere Metallurgy Project. … Continue reading
Posted in Dr. Ron
Tagged alloys, Denny Fritz, Greg Henshall, lead-free, SAC 305, solder paste, thermal cycle reliability, Werner Engelmaier
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