Tag Archives: SAC 305

Alloy Melting

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste.  One of our engineers claimed that the problem was that the tin finish melts at too high a temperature (Tm= … Continue reading

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Can Your Mortality be Modeled with Weibull Distribution?

Folks, In the last posting we saw how Weibull analysis helped us to determine that SACM lead-free solder (SAC 105 with about 0.1% manganese) has comparable (actually better) thermal cycle performance versus SAC 305 solder.  Software like Minitab will give … Continue reading

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Some Consensus on SAC

Back in November, I posted comments on lead-free availability. In this post, I mentioned that I chaired a session at SMTAI on Alternate Alloys. At this session, Greg Henshall presented a paper on the  Low Silver BGA Sphere Metallurgy Project. … Continue reading

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