Tag Archives: slope
Weibull Analysis II: The Curse of the Early First Failure
Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated (BTC) components (often called QFNs), that are also assembled with solder … Continue reading
Posted in Dr. Ron
Tagged failure, shape factor, slope, solder alloy, solder spread, Weibull distribution
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