Tag Archives: SMTAI
SMTAI-IPC Midwest Pact a Long Time Coming
John Mitchell is putting his money where his mouth is. As the new IPC president, installed just this spring, had made clear in multiple conversations we’ve had, he takes adding value for customers seriously, and he looks for ways various … Continue reading
Making the Rounds
We will be at several events over the next six weeks. On Thursday, senior editor Chelsey Drysdale will attend IMAPS’ annual symposium in Long Beach, CA. There’s a number of EMS companies focused on medical electronics exhibiting and it will … Continue reading
Posted in Hot Wires
Tagged Chelsey Drysdale, IMAPS, Productronica, SMTA, SMTAI, Sue Mucha, ZDAC, Zuken
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A New Trend in Assembly Shows?
Years ago, three major events dotted the US electronics assembly trade show landscape. They included Nepcon East, Surface Mount International, and the mother of them all, Nepcon West. While Nepcon West was the undisputed champ, all three shows were worth … Continue reading
Posted in Hot Wires
Tagged assembly, electronics design, fabrication, IPC Apex, Nepcon West, PCB design, PCB West, printed circuit board, SMTAI, surface mount, trade shows
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Hot Seat
I’ll be blogging from SMTAI in Orlando next week, where I’m chairing/co-chairing a couple of sessions on contract manufacturing. On Tues. Oct. 26, from 2:00pm – 3:30pm is Outsourcing Strategies: Niche Requirements and EMS Best Practices, featuring ODM or EMS: … Continue reading
Tighter Ratio Rules Ahead?
The long-held area ratio rule (the ratio of aperture size and stencil foil thickness) of 0.66 is under attack from all sides, it seems. Writing this month in CIRCUITS ASSEMBLY, columnist Clive Ashmore explains that improvements to the shear thinning … Continue reading
Posted in Hot Wires
Tagged Clive Ashmore, Kevin Liticker, paste volume, SMTAI, Stencil area ratio
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Tighter Ratio Rules Ahead?
The long-held area ratio rule (the ratio of aperture size and stencil foil thickness) of 0.66 is under attack from all sides, it seems. Writing this month in CIRCUITS ASSEMBLY, columnist Clive Ashmore explains that improvements to the shear thinning … Continue reading
Posted in Hot Wires
Tagged Clive Ashmore, Kevin Liticker, paste volume, SMTAI, stencil area ratio
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Trade (No) Shows
SMTAI is over and done. It was, in my opinion, a disappointment. While several companies remain on travel lockdown, the location — San Diego — was central to large numbers of designers and assemblers, precious few of whom bothered to … Continue reading