Tag Archives: SMTAI

Peter Biocca, RIP

Peter Biocca, the longtime face of Kester Solder in the southern US and Mexico, passed away Monday from cancer. I knew Peter for more than 15 years, dating back to his time with Multicore, when he was one of the regulars … Continue reading

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Low-Temperature Solders: Niche No More?

Folks, It surprises many people that the foundation metal of almost all solder alloys is tin. Alloy elements such as lead, silver, copper, indium, etc., are extremely important, as they lower the solder melting temperature below tin’s relatively high 232°C … Continue reading

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The Weakest Link: Musings from SMTAI

Due to an illness, I jumped in to co-chair a session at SMTAI yesterday. In doing so, I had the pleasure of spending a little time with a longtime industry machine designer. Afterward, he asked an interesting question: Talking to … Continue reading

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SMTAI-IPC Midwest Pact a Long Time Coming

John Mitchell is putting his money where his mouth is. As the new IPC president, installed just this spring, had made clear in multiple conversations we’ve had, he takes adding value for customers seriously, and he looks for ways various … Continue reading

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Making the Rounds

We will be at several events over the next six weeks. On Thursday, senior editor Chelsey Drysdale will attend IMAPS’ annual symposium in Long Beach, CA. There’s a number of EMS companies focused on medical electronics exhibiting and it will … Continue reading

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A New Trend in Assembly Shows?

Years ago, three major events dotted the US electronics assembly trade show landscape. They included Nepcon East, Surface Mount International, and the mother of them all, Nepcon West. While Nepcon West was the undisputed champ, all three shows were worth … Continue reading

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Hot Seat

I’ll be blogging from SMTAI in Orlando next week, where I’m chairing/co-chairing a couple of sessions on contract manufacturing. On Tues. Oct. 26, from 2:00pm – 3:30pm is Outsourcing Strategies: Niche Requirements and EMS Best Practices, featuring ODM or EMS: … Continue reading

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Tighter Ratio Rules Ahead?

The long-held area ratio rule (the ratio of aperture size and stencil foil thickness) of 0.66 is under attack from all sides, it seems. Writing this month in CIRCUITS ASSEMBLY, columnist Clive Ashmore explains that  improvements to the shear thinning … Continue reading

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Tighter Ratio Rules Ahead?

The long-held area ratio rule (the ratio of aperture size and stencil foil thickness) of 0.66 is under attack from all sides, it seems. Writing this month in CIRCUITS ASSEMBLY, columnist Clive Ashmore explains that improvements to the shear thinning … Continue reading

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Trade (No) Shows

SMTAI is over and done.  It was, in my opinion, a disappointment. While several companies remain on travel lockdown, the location — San Diego — was central to large numbers of designers and assemblers, precious few of whom bothered to … Continue reading

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