Tag Archives: solder alloy
Measuring Alloy Density
Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy density. Is this valid? Where does the formula come … Continue reading
Weibull Analysis II: The Curse of the Early First Failure
Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated (BTC) components (often called QFNs), that are also assembled with solder … Continue reading
Posted in Dr. Ron
Tagged failure, shape factor, slope, solder alloy, solder spread, Weibull distribution
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Interpreting Weibull Plots: I
Folks, A while ago I discussed the Weibull Distribution and its importance in electronics reliability analysis. This distribution has been used to evaluate the life of solder joints whether formed in SMT, wave, or even using solder preforms. In the … Continue reading