Tag Archives: solder joint reliabilty
Can Your Mortality be Modeled with Weibull Distribution?
Folks, In the last posting we saw how Weibull analysis helped us to determine that SACM lead-free solder (SAC 105 with about 0.1% manganese) has comparable (actually better) thermal cycle performance versus SAC 305 solder. Software like Minitab will give … Continue reading
Posted in Dr. Ron
Tagged electronics assembly, SAC 105, SAC 305, solder joint reliabilty, solder paste, Weibull distribution
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Why ‘Green Mold’ Might Be Bad for You
Researchers at IMEC have found that quartz-filled compounds used in place of halogen flame retardants in plastic packages lowered the CTE, and the subsequent mismatch in thermal expansion between the package and board is causing solder joint fatigue cracking, researchers … Continue reading
Posted in Hot Wires
Tagged component packages, mold compounds, solder joint reliabilty
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