Tag Archives: solder mask
Via-in-pad is an old issue that still pops up now and then. Our standard answer hasn’t changed: No open vias in pads. But one of the questions we get related to the subject is: “What if we make the vias … Continue reading
When I heard early this month that Foxconn (Hon Hai) chief Terry Gou offered to train Americans in electronic manufacturing I recalled one of Apple’s excuses for putting its production in Asia, much of which went to Foxconn which now … Continue reading
Here’s an interesting via in pad case. On the one hand, the footprint is very symmetrical and clean looking. On the other hand, it has open vias in the pads. At first glance, I thought this was a DIP footprint … Continue reading
Passive components can be kind of offensive sometimes. I can understand them in analog circuits or charge pumps. But the fact that we need to put them all over our digital logic is just rude. Technically, I understand why they … Continue reading
I’ve recently written a bit about solder mask and pads relative to BGAs. In most cases, we recommend NSMD (Non Solder Mask Defined), or copper pad defined, pad for BGAs. With the BGAs, the NSMD pads will permit the BGA … Continue reading
Old friend Michael Carano tweets that the main PCB inside the iPad has a darker solder mask. “Is Apple hiding something?” he asks. (The link shows the photos, too.) If you are on Twitter, be sure to follow Mike (@mikecarano1).