Tag Archives: SPC

Weibull Analysis of Solder Joint Failure Data II

Folks, Last time we introduced Weibull analysis. Let’s derive the relationships needed to calculate the slope, beta, and characteristic life, eta.   F(t) is the cumulative fraction of fails, from 0 to 1. By choosing Ln(t) as x and LnLn … Continue reading

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An SPC Rx

It was Wednesday evening and I had just finished a brief pitch on applications of SPC to a group of 20. I was followed by Jim Hall, who spoke of process mapping using SIPOC.  So did these folks have solder paste under … Continue reading

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