Tag Archives: SPC
Weibull Analysis of Solder Joint Failure Data II
Folks, Last time we introduced Weibull analysis. Let’s derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the cumulative fraction of fails, from 0 to 1. By choosing Ln(t) as x and LnLn … Continue reading
An SPC Rx
It was Wednesday evening and I had just finished a brief pitch on applications of SPC to a group of 20. I was followed by Jim Hall, who spoke of process mapping using SIPOC. So did these folks have solder paste under … Continue reading