Tag Archives: thermal cycling

Weibull Part III

Folks, Our discussion of Weibull Analysis continues…. Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste and some lead-free solder preforms as you assembled several through-hole … Continue reading

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Pb-Free Reliability Under Harsh and Commerical Environments

Folks, In gathering information on the status of lead-free soldering, some helpful friends pointed out two great sources of information: NASA and the US Navy. NASA sponsored an impressive lead-free reliability investigation: “Lead-Free Solder Testing for High Reliability Project 1.” This project … Continue reading

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