Tag Archives: tombstoning

Revelations at ACI

Folks, I’m taking a few moments from Wassail Weekend, held annually in my village, Woodstock, VT (“The prettiest small town in America”), to write a post about the recent workshops at ACI. Indium colleague Ed Briggs and I gave a … Continue reading

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Via Shifting

Here’s an example of what via in pad can do for a small passive component. Other things can happen too, like tombstoning or twisting. But take a close look at this photo. In doing so, you’ll note that both sides … Continue reading

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Little Chippy Challenges

And “chippy,” in this context, refers to chip caps and any other tiny two-connector components. When considering surface mount, most people think of the many-connector parts, like BGAs and QFNs as the challenging components. That’s mostly true. However, the little … Continue reading

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Let the Data Be Your Driver

I was recently asked to give a presentation and audit an assembly line regarding minimizing “tombstoning” of passives at a major electronics assembler. As my presentation brought out, tombstoning can be caused by many factors: the reflow profile, the solder … Continue reading

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