Tag Archives: Via-in-pad

Will a Via Fit Between?

Posted on April 15, 2013 by Duane

I don’t know that it would be accurate to say that BGAs have ever been easy, but with 0.4mm pitch being common and 0.3mm pitch showing up, some of the older size, like a WHOLE millimeter pitch seem positively spacious. … Continue reading →

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Via in Pad X 8

Posted on September 7, 2012 by Duane

Here’s an interesting via in pad case. On the one hand, the footprint is very symmetrical and clean looking. On the other hand, it has open vias in the pads. At first glance, I thought this was a DIP footprint … Continue reading →

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How Not to Trick Your BGA Friends

Posted on June 13, 2012 by Duane

Continuing with yesterday’s theme, I have a couple examples that should have been fine, but due to issues at the board house, improper storage or contamination, ended up very much not fine. Behind door number one, we have an OSP … Continue reading →

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BGA Pads with Vias

Posted on October 25, 2011 by Duane

No. This isn’t a closeup of an owl face. There is still some debate on how best to create a land pattern for a 0.4mm pitch BGA. We recommend solder mask defined pads at that pitch. But that’s not really … Continue reading →

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Small Open Vias

Posted on September 21, 2011 by Duane

Pad parts change and so do vias. Our standard policy here is that open vias in pads are bad. We from time to time recommend ways to plug them. Generally, you have several options. Like this post shows. However, with … Continue reading →

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Via Current Capacity

Posted on June 20, 2011 by Duane

After my blog item last week, Michael asked a question about my Via in Pad Myth #5. He asked: I have a question about vias. I have seen charts on the current carrying capacity of traces, but what about vias? … Continue reading →

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Random Via-In-Pad Myth #5

Posted on June 15, 2011 by Duane

Myth #5: When you need thermal vias, more is better, bigger is better Hmmm. Logically, this would seem to be the case. There are limits though; especially if you want a reliably assembled product. Older parts with heat slugs easily … Continue reading →

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Little Chippy Challenges

Posted on November 10, 2010 by Duane

And “chippy,” in this context, refers to chip caps and any other tiny two-connector components. When considering surface mount, most people think of the many-connector parts, like BGAs and QFNs as the challenging components. That’s mostly true. However, the little … Continue reading →

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PCB Planarity, Not Polarity

Posted on November 4, 2010 by Duane

Via-in-pad can ruin a manufacturer’s whole day. Or, if properly done, can go completely unnoticed. There are a number of ways to properly put a via in a pad but the best is to have it filled and plated over … Continue reading →

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Random Via-in-Pad Myth #7

Posted on October 29, 2010 by Duane

Myth #7: In regards to via-in-pad, all PCB finishes are the same Well, it might seem so, but let’s look a little closer. No. Not that close. Back the camera up a bit. Here’s a good example: In some cases, … Continue reading →

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