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FEATURES

China in Charge

China in Charge

The 2014 ranking of the largest board fabricators reveals quiet but steady growth by domestic Chinese companies.  Read More...

US or Mexico: Which Option Makes Most Sense for Your Project?

US or Mexico: Which Option Makes Most Sense for Your Project?

Making accurate cost comparisons goes beyond hourly labor rates.  Read More...

Depaneling of Circuit Boards

Depaneling of Circuit Boards

A review of the impacts various methods have on the final product.  Read More...

Managing Your Environmental Waste

Managing Your Environmental Waste

An outline of procedures for determining and recycling hazardous material.  Read More...

Rigid-Flex PCB Design for an Innovative Helmet-Mounted Display

Rigid-Flex PCB Design for an Innovative Helmet-Mounted Display

Developing a wearable high-speed board with severe timing constraints.  Read More...

Advanced Acoustic Methods for Locating Flip Chip Faults

Advanced Acoustic Methods for Locating Flip Chip Faults

Echoes can reveal otherwise elusive defects beneath the die.  Read More...

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PRODUCTS

SPEA, Goepel Integrate Boundary Scan into SPEA3030 ICT

SPEA, Goepel Integrate Boundary Scan into SPEA3030 ICT

Boundary scan is now available in SPEA3030 multi-core in-circuit test. Boundary scan tests are now possible on all cores of the ICT (up to four). Can perform pa...  Read More...

Juki Introduces JX-350 SMT Placement Machine

Juki Introduces JX-350 SMT Placement Machine

JX-350 is a long board SMT placement machine. Is the successor to LED dedicated mounter JX-300LED. Reportedly improves the placement ability of diffusion lenses...  Read More...

Techspray Introduces Precision-V No-Clean Flux Remover

Techspray Introduces Precision-V No-Clean Flux Remover

Precision-V no-clean flux remover is nonflammable and non-ozone depleting. Works on no-clean, halide-free, rosin, and aqueous OA fluxes. Has low toxicity. Tech...  Read More...

Shenmao Introduces PF606-P26 Halogen-Free Solder Paste

Shenmao Introduces PF606-P26 Halogen-Free Solder Paste

PF606-P26 no-clean, halogen-free solder paste is said to prevent BGA non-wet opens and head-on-pillow defects. Is printable, wets and solders well even if BGA c...  Read More...

Master Bond Releases EP21NDCL Epoxy

Master Bond Releases EP21NDCL Epoxy

EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. ...  Read More...

Polyonics Develops XF-731, XF 732 Labels

Polyonics Develops XF-731, XF 732 Labels

XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elev...  Read More...

Manncorp Introduces RW1210 Rework System

Manncorp Introduces RW1210 Rework System

RW1210 rework system contains selectable operating modes that fully automate removal, placement, and soldering sequences. Includes enlarged board holder to han...  Read More...

FSInspection Unveils VERSAMag HD Inspection System

FSInspection Unveils VERSAMag HD Inspection System

VERSAMag high-magnification HD inspection system has a multi-axis, high-res camera that tilts and rotates for multiple angle inspection with an adjustable Z-hei...  Read More...

Nordson EFD Releases PICO Touch Controller

Nordson EFD Releases PICO Touch Controller

PICO Toµch controller reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts. Featur...  Read More...

Nordson EFD Introduces PICO Pulse Valve

Nordson EFD Introduces PICO Pulse Valve

PICO Pµlse non-contact jet valve reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz max. bursts...  Read More...

Techcon Systems Develops TS5624DMP Valve

Techcon Systems Develops TS5624DMP Valve

Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning....  Read More...

Nordson March Upgrades StratoSphere Series Plasma Treatment Equipment

Nordson March Upgrades StratoSphere Series Plasma Treatment Equipment

StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for i...  Read More...

Production Solutions Introduces Vault Tooling Part Holder

Production Solutions Introduces Vault Tooling Part Holder

Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can...  Read More...

Finetech Releases Martin MiniOven 05

Finetech Releases Martin MiniOven 05

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature ...  Read More...

Henkel Develops Gap Pad EMI 1.0 TIM

Henkel Develops Gap Pad EMI 1.0 TIM

Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy contr...  Read More...

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