Process Control
Pb-Free Manufacturability and Test Control
Lead-free solder is not a drop-in replacement electrically or mechanically. Determining the "sweet spot" between electrical contact and mechanical deformation.
Terence Q. Collier
Line Automation
Can Odd-Form Automation Increase Returns?
Still placing odd-form parts by hand? How to determine ROI of end-of-line automation.
Allen W. Duck and Patty Chonis
Cover Story
Assessing Solder Joint Reliability in Pb-Free Assemblies
A study finds distinctions between predictors of reliability for leaded and lead-free alloys.
Steve Dowds
Screen Printing
Throughput vs. Cycle Time in Evaluating Paste Printing
Is the best indicator of performance machine cycle time, or first-pass yield?
Joe Belmonte and Bob Boyes
Process Control
Enabling Quick Response Manufacturing
End manufacturing and supply-chain redundancies through software that enables flexible operations and fast changeovers.
Doug Johnson and Vern Harrison
Parts Management
Programming for Mixed-Vendor Lines
Creating part data libraries for placement machines is time-consuming, error-prone and labor intensive. New tools can automate the process.
Bini Elhanan
Caveat Lector
Cracking the WIP.
Mike Buetow
On the Forefront
A hard look at solid solder deposit.
Phil Zarrow
Talking Heads
Siemens' Tilo Brandis.
Mike Buetow
EMS Insight
A challenge to the new ODMs.
Pamela Gordon
ESD Basics
A renewed need for ESD control.
ESD Association
Process Doctor
Diagnosing residue problems.
Terry Munson
Industry News
Market Watch
Ad Index
Assembly Insider
Product Spotlight
On the cover: Design and process factors are the focus of this month's cover story. (photo © David Freund)
Virtual Manufacturing
A Supply-Chain Engineering Solution
Most EMS companies have seen limited success providing design-related services to OEMs. A new method known as "Virtual Cluster" proposes to bring together best-in-class companies for design project engineering and supply-chain functions, to reduce cost and time-to-market.
Bill Coker
Cover Story
Pb-Free Reflow and Rework
While long-term reliability evals are ongoing, NEMI has found that when using optimized tools and processes carried out by experienced personnel, SnAgCu reflow forces a big hike in melt temperature. A list of findings and recommended changes for lead-free reflow and rework.
Matt Kelly, Quyen Chu and Jasbir Bath
Large Format Rework
Large Format Rework for Eutectic and Lead-Free Applications
Meeting specific rework needs of disparate boards requires a move away from one-size-fits-all equipment. The combination of full-bottom-panel, low-mass IR heating, stationary board fixturing and gantry-type reflow can eliminate many warping problems faced when reworking large BGA boards.
Stan Kench
Optical Inspection
Lead-Free First-Article Inspection
Smaller process windows of lead-free alloys put greater demands on soldering equipment and inspection equipment and procedures. What are the typical process concerns associated with LF alloys for first-article OI and line qualification?
Mark Cannon
Data Reliability
Manufacturing Effects on Data Retention of Nonvolatile Memory Devices
There is negligible effect on data retention by soldering NVM devices after they have been programmed.
Kelly Hirsch
Caveat Lector
Mr. President, your time is at hand.
Mike Buetow
On the Forefront
SiP gets dialed in.
E. Jan Vardaman
Talking Heads
Hisco's Bill Baird.
Mike Buetow
Emerging Technology
Battlebots: fighting tomorrow's wars.
Ken Gilleo
Focus on Business
Marketing programs that work.
Susan Mucha
Process Doctor
Inadequate reflow profiles cause weak joints and flex residues.
Terry Munson
Industry News
Market Watch
Assembly Insider
Product Spotlight
Ad Index
Classifieds
On the cover: An intensive collaborative investigation reveals certain parameters for lead-free rework.
Fume Extraction
Airing it Out
Thanks to higher soldering temperatures and more aggressive fluxes, fumes from lead-free solders are more harmful than those of tin-lead. What precautions are you taking?
Karl Schuepsthul
Business Opportunities
The Remanufacturing Equation
Remanufacturing - restoring products to a like-new condition - is a $50-billion market, and a source of new business for assemblers. A study of three tech products shows a potentially hefty market, at the right discount.
Mark Knight and Jonathan D. Linton, Ph.D.
Pb-Free Solder Pots
A Study of Lead-Free Hot Air Leveling
Questions have arisen over copper dissolution into lead-free alloys, particularly the use of alloys that may require added solder pot maintenance. An investigation into controlling lead-free HAL, plus maintaining the pot and separating copper intermetallics.
David Suraski
Texas Prototypes
For NPI, Texas Prototypes Doesn't Mess Around
From a quiet start as an NPI arm of a tier one EMS provider, Texas Prototypes has spun off and branched out, and its band of engineers provides everything from product launch to lifecycle management.
Lisa Hamburg Bastin
Cover Story
Controlling Pb-Free Processes through AOI
Will AOI prove effective in identifying differences in the appearance of lead-free solder? To wit: does a billboarded chip look the same? What about an insufficient solder joint? A look at how lead-free PCBs impact in-line systems.
Thorsten Niermeyer
Underfill Selection
Preventing Voids in CSP and BGA Underfill Encapsulants
In a CSP or BGA underfill process, several potential sources of voids exist. Sidestepping voids starts with picking the right material, be it the paste or the underfill.
Karl Loh and Edward Ibe
Caveat Lector
New models for old problems.
Mike Buetow
On the Forefront
Why your area array could use a good colonoscopy.
Dr. H.J. Zapfardt
Talking Heads
IMI's Arthur Tam.
Mike Buetow
EMS Insight
"Why I bucked the outsourcing trend."
Pamela J. Gordon, CMC
IPC Standards
J-STD-001D and IPC-A-610D: A little closer.
Jack Crawford
Problem Solved
Considerations for shifting to high-mix without retooling an entire line.
Peter Bollinger and Shawn Robinson
Industry News / Market Watch
Assembly Insider
Ad Index
Product Spotlight
On the cover: SEEING IS BELIEVING - Optimizing AOI for lead-free processes. (Photo courtesy Agilent Technologies)
Screen Printing
Reducing Variation Through 'Intelligent' Stencils
Stencil variation arises from equipment error and human intervention. A study reveals sources of variation and a system for controlling them.
Chrys Shea, Valentijn Van Velthoven, Ron Tripp and Ranjit Pandher
Stencil Developments
Next-Generation Interchangeable Foils
Said to be easier to load and unload and safer to use, new and improved foils are finding a home in high-mix manufacturing.
Neil MacRaild
Cover Story
An On-Board Mass Calibration System for Liquid Encapsulation
For dispensing epoxy, engineers often focus on short-term pump repeatability as an equipment selection and qualification criterion, though it is useful only as a snapshot of pump capability. More important, as this investigation reveals, is the ability to quickly and easily measure and adjust the process centering over time.
Thomas Karlinski
Pb-Free Soldering
Considerations for Implementing Lead Free
Planning to upgrade or replace your line to meet new lead-free standards? Be sure you know what you're in for.
Mark Cannon
Products
ATExpo Product Spotlight
What's new at the annual ATExpo trade show later this month.
Editorial
New packages: smaller and greener.
Mike Buetow
The Fine Pitch
Q&A with Neil MacRaild, DEK Americas general manager
On the Forefront
Tin whiskers: Still scratching after all these years.
E. Jan Vardaman
Focus on Business
Three EMS providers discuss challenges and opportunities of adopting lead-free practices.
Sue Mucha
ESD Basics
The six elements of a successful program.
ESD Association
Process Doctor
Moisture plus flux residues add up to failures.
Terry Munson
Letters
Industry News / Market Watch
Assembly Insider
Ad Index
Classifieds
ON THE COVER - Eye of the needle: improving dispensing repeatability through weight management tools. (Photo courtesy Speedline Technologies.)
Cover Article
High Stakes: Reworking High-Precision, High-Reliability Boards
Successfully reworking high-reliability assemblies is challenging, even for the most experienced of operators. However, it can be made easier and safer by deploying the right tools and safeguards.
Franck Bitton
Lead Free
Avoiding Tin Whisker Reliability Problems
Fighting tin whiskers involves knowing the available mitigation strategies and risk analysis based on lead spacing.
G.T. Galyon and Ron Gedney
Focus on Business
Covert Money Losses in Outsourcing
Understanding the less obvious sources of wasted money in OEM/EMS manufacturing relationships.
Edwin B. Smith, III
Component Placement
Automatic Recognition of Electronic Components
Automatically recognizing electronic components can reduce rejected components and increase placement accuracy, yields and surface-mount line throughput.
Gallagher Donovan Pryor, Alex Goldstein, Allen Tannenbaum
Focus on HDI/Advanced Technology
Current Trends in Optoelectronics
EMS providers and equipment suppliers are working together to make high-volume optoelectronic component manufacturing a reality.
Bruce W. Hueners and Paleerat Lakawathana
Editorial
On the Forefront
Phil Zarrow
Emerging Technology
Dr. Ken Gilleo
Ask Les
Les Hymes
Problem Solved
Peter Bollinger
Industry News
NETgain
Europe Watch
The Fine Pitch - Q&A with Stephen Delaney, CEO, Celestica
Assembly Insider
Ad Index
Globaltronics Product Spotlight
Cover artwork courtesy of Metcal, Menlo Park, CA.
COVER ARTICLE
Effect of High-Temperature Requirements for Lead-Free Solder
Although the thought of processing lead-free solder moves us out of our traditional comfort zones, the information and techniques needed to be successful are available.
Fred Dimock
ON THE ROAD
NEPCON Shanghai Recap
The world grows smaller.
Dan Beaulieu
FOCUS ON BUSINESS
Supply Chain Collaboration
Managing the most-effective supply chain.
Paul Mounkes
SCREEN PRINTING
Stencil and Screen Printing Q&A
A list of some of the most frequently asked questions concerning screen printing in electronics manufacturing.
Alden Johnson
Editorial
On the Forefront
E. Jan Vardaman
Standard Features
Jack Crawford
ESD Basics
Craig Zander
Process Doctor
Terry Munson
Industry News
NETgain
Market Watch
The Fine Pitch - Q&A with Hal Stern, CTO, Sun Services
Assembly Insider
Ad Index
SEMICON West Product Spotlight
Cover illustration courtesy of BTU International, North Billerica, MA.