Micro3Dslices produces superior laminography results and automatic analyzes the slice-by-slice images in less than 40 sec. per part. Uses virtual rotation axis to allow the region of interest to be chosen at any point on the large inspection area. Provides constant inspection results. For semiconductor and wafer inspection, 2D imaging and other inspection routines including QFN inspection.

Yxlon International, yxlon.com

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