J8 no-clean solder paste is for use with a variety of jetting paste equipment. Provides consistent solder deposits as small as 200μm. Is fully compatible with all AIM no-clean solder pastes for use in applications where jetted paste deposits are combined with printed paste deposits. Novel activator system provides durable wetting action, accommodating a range of profiles and producing bright, shiny joints without graping. Reduces voiding to as low as <5% on BGA and <10% on BTC ground pads.

AIM Solder, aimsolder.com

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