Alpha OM-353 is an ultra-fine feature print and air reflow-capable solder paste ideal for assemblies sensitive to component warpage or processes that require cleaning. Has been tested to provide printing performance down to 180µm pad size. Alpha OM-535 is a low-temperature paste with excellent drop shock resistance and electrical reliability for low-temperature reflow applications.  Reportedly produces excellent solder joint and flux residue cosmetics, even when using long/high thermal soaking.

Alpha Assembly Solutions, alphaassembly.com

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