Rehm Rolls Out CondensoXC Reflow Condensation Soldering
Published: 18 January 2017
CondensoX performs reflow soldering by means of hot steam and Galden medium.
Processes large, heavy boards since the heat transfer is up to 10 times higher than with convection soldering. Use of injection principle and precise temperature and pressure controls ensure accurate and diverse reflow profiling. Ideal for laboratory applications, small batch production or prototyping. Vacuum option reduces soldering voids.
Rehm
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