MARKHAM, ONTARIO – The SMTA issued a call for abstracts for the International Conference on Soldering and Reliability, which will take place here June 6-8.

Starting in 2017, the scope of the conference will broaden to include physical design aspects relating to electronics component, product and system reliability, involving topics such as thermal and mechanical design, design for manufacturability, test and signal integrity.

For more information or to submit an abstract, visit www.smta.org/icsr. The deadline for abstracts is Feb. 28.

The conference is co-sponsored by the SMTA Toronto Chapter and co-located with the Toronto SMTA Expo.

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