SOUTH BARRINGTON, IL – BEST Inc. will hold a technical symposium on micro device assembly here on Oct. 1.

This symposium will focus on the challenges involved in small footprint device assembly.

Dr. Ronald Lasky will provide understanding of the design of experiments to solve these assembly problems.

Other speakers and topics include Chrys Shea on metal stencil design; Joesph Kim of Koh Young on SPI measurements; Ken Gribble of Nikon on x-ray and AXI; Nico Coenen of Mydata on jetting for prototyping, and Paul Wood of Metcal on hand soldering and rework techniques.

For more information, contact Laura Ripoli at lripoli@solder.net.

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