MP-520 SiP inspection system combines precision linear drive motor technology with 25MP CoaXPress camera, 3D confocal measurement system and Omni-vision 3D digital multi-frequency moiré technology. Is configured with eight phase color lighting and four 10MP side-view cameras. For measurement and inspection of solder ball/bumps, bond wire, chip bonds, discrete devices, heat sinks, underfill, printed circuit boards, and packages. Results are stored in a central database, enabling remote access SPC data through Intellisys total quality management system software.

Mirtec, www.mirtecusa.com

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