Newhorizon pulsed heat reflow soldering system is for flex to ceramic, component to printed circuit board, flex to PCB, wire to PCB, and leadframe to PCB. Uses Uniflow 4 pulse heated reflow soldering power supply; hot-bar reflow soldering system provides integrated heat process control. Includes pneumatic bonding heads and 2-D or 3-D thermodes, X-Y thermode planarity adjustment, electronic temperature and system control, and digital bond force readout. Features active integrated cooling for heavy duty cycle operation. Is mounted on an adjustable frame; includes front-rear linear slide and manual or pneumatic rotary tables. Process parameters are embedded. Options include optical plug-and-play alignment modules and an interposer module for both Kapton and Sarcon tape in manual and automatic configurations.

Amada Miyachi America, www.amadamiyachi.com

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