High Performance Printed Circuit Boards Print E-mail
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Written by Bob Willis   
Tuesday, 25 March 2003 19:00

ImageBy Charles Harper
McGraw Hill
9 chapters and appendix of IPC standards

Currently, this book is one of the most up-to-date textbooks on printed circuit board (PCB) technology and well worth the investment. Overall, the book is well illustrated, but selected chapters could have used more diagrams and photographs.

All the areas of high performance PCBs are covered in this book, with an entire section devoted to the concepts and types of microvia technology used in the industry. The cost implications and design requirements are defined along with the process steps. More information on design issues and the problems they can cause during assembly would have been beneficial to the reader. The book also has a few application examples of microvias, most of which relate to telecom and high-end consumer electronics.

The use of alternative substrates such as ceramic and flex are discussed along with buildup technology, which has become very popular, with Japan currently leading the world. Issues relating to the environment are considered specifically where they relate to PCB manufacture.

This textbook is very worthwhile and produced as one of the new McGraw Hill Professional Engineering series.


 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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