| Engineers Handbook of Encapsulation and Underfill Technology |
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| Written by Bob Willis | |||
| Tuesday, 25 March 2003 19:00 | |||
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This is one of the first textbooks to be released on the use of encapsulants and underfills, and it makes a good companion to the flip chip books by John Lau. Other technology reports exist, but Martin Bartholomew, from Multicore, has provided a very useful reference source. The book covers materials, applications and assembly issues, and provides helpful illustrations at each stage. It does, however, fall short of providing good photographs of products and the assembly techniques. The text would have benefited from more examples of products that are well documented in the industry.
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Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...
