| Electronics Manufacturing with Lead-Free, Halogen Free & Conductive Adhesive |
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| Written by Bob Willis | |||
| Monday, 24 March 2003 19:00 | |||
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The book consists of 600 pages, 20 chapters, illustrated with diagrams and many photographs and SEMs Yet another title edited by John Lau, C P Wong, Ricky Lee and featuring chapters from Ning Chang Lee of Indium Corporation. There can't be many people in the industry that have not heard or seen these engineers at exhibitions or conferences, they are all well known internationally. This is a very good reference for all that is going on in electronics linked to the environmental lobby and, of course, lead-free which is the issue on everyone's lips. Chapter 5 cover the issues of lead-free alloys at chip wafer level, the impact on moulding compounds, PCBs and the laminate constructions. What John Lau has done has collected together much of the research and practical results with success and failure. Ning Change Lee has contributed four chapters to this textbook. His contribution mainly covers lead-free materials and the use of lead-free assembly techniques I guess the only issue not covered in detail is the equipment issues. Chapter 1 & 11 updates the reader on the legislation, a subject that leaves this reviewer cold but is the driving force for change. The current and proposed legislation is discussed and its impact on the industry. There is reference to the different timescales per country, what will happen and when. However, this changes on a monthly basis. Although there are countless patents for alternative solder alloys chapter 6 rightly highlights that only a limited number will be used. Ideally every engineer wants a simple choice and the decision made for him. It would seem in the industry that Sn/Ag/Cu will be the most common choice. Final verdict, it is worth the investment, there is not much competition currently in the marketplace for a book of this type; only the lead-free book by J Hwang is close to this. Yes I think it is worth the investment but don't forget the handbook by Katsuaki Suganuma of Osaka University with a new title out mid 2003. Many thanks to the publishers for the opportunity to review another lead-free
title, it may cover lots of other topics but it will sell for lead-free. Also
thanks to Ning Chang Lee for my signed copy.
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Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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Products
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...


John Lau, Ricky Lee, Ning Chang Lee and
Wong