Past Book Reviews

This page is dedicated to keeping engineers up-to-date with the latest industry literature. I do not sell the books, I just enjoy reading and reviewing material from around the world written by engineering peers.

This is a personal review of the latest electronics/process books to be offered for sale. As you will see, there is a mix of titles, but there is something for every taste and budget.
Title Filter     Display # 
# Article Title Author
21 Area Array Packaging Handbook Bob Willis
22 Surface Mount Technology Terms & Concepts Bob Willis
23 Surface Mount Technology for PC Boards Bob Willis
24 Surface Mount Handbook Bob Willis
25 Standard Handbook of Environmental Engineering Bob Willis
26 Solders and Soldering - Fourth Edition Bob Willis
27 Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies Bob Willis
28 Microvias for Low Cost, High Density Interconnects Bob Willis
29 Low Cost Flip Chip Bob Willis
30 High Performance Printed Circuit Boards Bob Willis
31 Handbook of Mechanical Engineering Calculations Bob Willis
32 Green Electronics/Green Bottom Line Bob Willis
33 Environmental-Friendly Electronics: Lead-Free Technology Bob Willis
34 Engineers Handbook of Encapsulation and Underfill Technology Bob Willis
35 Electronic Packaging and Interconnection Handbook, 3rd Edition Bob Willis
36 Electronic Connector Handbook Bob Willis
37 Design of Stencils for Printing Solder Paste on Surface Mount Printed Boards Bob Willis
38 Conductive Adhesives for Electronics Packaging Bob Willis
39 Physical Metallurgy Handbook Bob Willis
40 Lead-Free Handbook Bob Willis
 
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Columns

Semblant Warms to New Fluoroolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

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ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.
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Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.
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Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

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Products

GÖPEL Upgrades TOM AOI for Conformal Coatings
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...