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Electronic Systems’ Explains RoHS Strategy at Seminar Print E-mail
Written by Mike Buetow   
Wednesday, 22 March 2006
SIOUX FALLS, SD – Electronic Systems Inc. recently shared lessons learned from its RoHS compliant processes at a workshop for executives and engineers.

About 70 persons from two dozen electronics companies attended the in Bloomington, MN, seminar to hear the EMS company, which has RoHS compliant products in production and pilot stages, describe everything from solder materials and profiles to supply chain management.

ESI said the seminar was meant to be a jump start for those who’ve not yet committed to a RoHS strategy. The first deadline for compliance is July 1, 2006.

According to company vice chairman Leo Reynolds, the seminar was not for “answer(ing) the unanswerable questions but rather to make our customers aware of the impending deadline and jog them into the realization that they need to be very aware of what may or may not have to do with their products and processes.”

Questions revolved around tin whiskering, preferred PWB finishes and soldering temperatures, he told Circuits Assembly. There were “a lot of questions on component availability and compliance [and] on verifying compliance, how can the EMS company ensure that every component is in fact lead-free compliant.”

“Obviously, there are as many unanswerable questions as there are solid ones in this whole RoHS issue.”

Speakers included Tony Hilvers, vice president of industry programs at IPC, who reviewed RoHS requirements and discussed issues related to managing the supply chain, processes and verification. Dave Paluck, ESI manufacturing engineering supervisor, gave an overview of the company’s soldering and assembly processes, while director of program management Steve Hillesheim explained the logistics and planning needed for an OEM to move product into compliance.

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