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SIPAD Systems Adds 2 Flattening Systems |
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Contributed by Robin Norvell
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Friday, 09 June 2006 |
Alpharetta, GA -- SIPAD Systems Inc. (SSi) has purchased two SIPLAN 300 flattening systems to help offer solid solder deposit (SSD) services to OEMs, CMs and PCB facilities.
According to owner and founder Matt Kehoe, the flattening system is an integral component to the SSD process. “This is no longer a niche or secondary process step for many of our customers who have turned over all of their paste application to SIPAD Systems,” Kehoe said in a press release. “They’ve incorporated SIPAD ssd into their schedules and need fast dependable service.”
The SIPAD process was invented in Germany in by Dr. Werner Maiwald of Siemens AG. The process pre-loads the surface-mount pads with flattened solid solder deposits that are coated with adhesive flux to hold components securely in place, eliminating the need for screening solder paste prior to reflow. The boards are delivered with a protective paper to keep the flux tacky for up to 6 months. Parts can be placed by hand or automatically.
SSi has seen steady growth since its inception in August 2001. Sales increased 58% in 2005 and are up 110% over that in the first half of 2006. As Kehoe recalls, “We started 40 days before 9/11/2001 so the first 18 months were a little shaky but 3 ½ years later the word has gotten out, and the SIPAD SSD finish is now found on drawings and purchase orders of major commercial and military companies throughout the U.S.”
Major growth areas include the RohS initiative, microwave technology, RF designs and thin core/flex circuits.
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