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SMTA Soldering and Reliability Conference To Be Held in Toronto |
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Written by Chelsey Drysdale
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Tuesday, 16 January 2007 |
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TORONTO – The SMTA-produced International Conference on Soldering and Reliability will be held April 17-19 in Toronto.
Topics to be covered include SnPb with lead-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; supply chain issues; advanced packaging; new substrate materials; surface finishes; thermal interface materials, and underfill.
To present, please submit a 200- to 300-word abstract to Melissa Serres at melissa@smta.org by Jan. 31. Include title, author’s name and contact information. Technical papers are optional, but PowerPoint presentations are required and due March 23.
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