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Chartered, Tezzaron Deliver High-Speed Memory Chips |
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Written by Chelsey Drysdale
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Wednesday, 13 June 2007 |
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SINGAPORE – Chartered Semiconductor Manufacturing is ramping production of Tezzaron Semiconductor’s ultra high-speed memory chips.
In addition, the two companies are working on the manufacture of Tezzaron’s 3-D devices, and hope to see them become the first 3-D ICs to be manufactured in volume.
With Tezzaron’s FaStack technology, device circuitry is divided into sections built onto separate wafers using standard processing. Chartered enables 3-D stacking of these wafers by building hundreds of thousands of Tezzaron’s embedded thru-silicon interconnections, called Super-Contacts, into the circuitry on each wafer. The wafers are then aligned with a precision of 0.5µm, bonded, thinned, and diced into individual devices. A FaStack chip functions as a single device.
Chartered and Tezzaron will enhance the 3-D IC designs and build them into wafers produced by Chartered. Tezzaron plans to offer many types of 3-D IC memories in two, three and five layers using NanoTSV technology.
Chartered is also manufacturing Tezzaron’s 3T-iRAM family of 2-D 72Mb memory devices.
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