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Lord Corp. Expands Materials Labs, R&D Center |
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Written by Chelsey Drysdale
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Thursday, 26 June 2008 |
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CARY, NC – Lord Corp., supplier of thermal management materials, adhesives, coatings and encapsulants, has invested $2.5 million to renovate its electronic materials labs at its headquarters here.
The expansion permits Lord to increase capabilities for technology development, including live device reliability testing on individual packages, says John Hill, technology manager for Lord’s Electronic Boards and Components Industry Group.
As part of the expansion, the firm consolidated labs previously located in Elverson, PA, and Indianapolis. The expansion includes about 7,500 sq. ft. of new or refurbished lab space and more than $600,000 in new instruments and equipment.
The expansion includes purchase of the latest finite element analysis (FEA) tools.
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