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CIRCUITS ASSEMBLY covers the world of electronics manufacturing: the products and processes, the market and the companies. We publish print and digital versions of the magazine monthly. Plus we have a highly trafficked website (with translation capability into dozens of languages) and a regular e-newsletter. And our editors regularly blog, ensuring continual two-way communication with readers.

What We Cover

• SMT and plated through-hole processing.
• Screen printing.
• Dispensing.
• Placement.
• Soldering.
• Test and inspection.
• Rework and repair.
• Procurement.
• Components and packaging.
• New equipment and materials.
• Markets and business issues.
• Solar and emerging technologies as they relate to electronics assembly.

For more than 20 years, CIRCUITS ASSEMBLY has met two goals:
• Publish the best technical articles on electronics manufacturing.
• Publish them quickly.

Each issue – print and digital – contains:
• A full-length cover story.
• Ten to 20 one-to-two page articles discussing particular technologies, processes or products of interest.
• A page of abstracts from recent technical conferences, with links to the complete articles on the Web.

Features that appear in print also appear on circuitsassembly.com, and vice versa.

In touch with readers. Our editorial model rests on the basic concept that the volume of information available increases almost exponentially each year, and that our publication must act as the filter to sort what is truly important from what’s just noise. We do so through regular polling of subscribers to ascertain what topics are of most interest to them. And we take that data and build the editorial content around it.

We use a novel first-in, first-out process for news and contributed articles. When we approve a submitted draft for publication, it will be published in the next available issue and not, for example, “in November, maybe.”

Social media. The editors maintain a regular blog to help spark and maintain a consistent and two-way dialogue with readers, who flock to the site by the thousands every month! Authors include the CIRCUITS ASSEMBLY editors, plus a host of topnotch experts on soldering materials, soldering, Lean manufacturing, DfM issues, and more.

We also take advantage of social media like LinkedIn, Facebook (CIRCUITS ASSEMBLY) and Twitter (@mikebuetow). New in 2012 was PCB Chat, the industry's first moderated chat forum, and Board Talk, the industry bulletin board.

Outside contributions. CIRCUITS ASSEMBLY welcomes outside contributions. Those interested in writing a technical article should contact Mike Buetow at This e-mail address is being protected from spambots. You need JavaScript enabled to view it . New product announcements and other news items of note should be sent to Chelsey Drysdale at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

Complete author guidelines may be found at http://circuitsassembly.com/cms/magazine/205-editorialcontributions.

 

Columns

Semblant Warms to New Fluoropolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

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ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

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Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

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Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

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