| Multi-Seals Offers F05 Poly-Form Adhesives |
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| Written by Chelsey Drysdale | |||
| Thursday, 01 November 2012 15:55 | |||
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F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. Has negligible vertical flow, keeping the adhesive contained in defined areas. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is reportedly consistent from bond to bond. Temp. and time required depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temp. is 225°F (107°C). A typical processing schedule is 275°F (135°C) for 10 min. under 5 psi.
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
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Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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