Nordson DAGE Launches XM8000 Wafer X-ray Metrology Platform Print E-mail
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Written by Mike Buetow   
Monday, 20 January 2014 10:53

XM8000 wafer x-ray metrology platform reveals optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Provides nondestructive, inline wafer measurement of voiding and fill levels, overlay and critical dimensions.

Nordson DAGE, www.nordsondage.com






 

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